Method of manufacturing display panel and display apparatus including the display panel

ABSTRACT

A method of manufacturing a display panel includes providing an insulating substrate that includes a hole area, a display area that surrounds the hole area, and a peripheral area adjacent to the display area, forming a semiconductor pattern in the display area, forming an insulating layer, forming contact holes in the insulating layer that expose portions of the semiconductor pattern, and forming a module hole by etching a portion of the insulating layer and a portion of the insulating substrate that overlap the hole area.

CROSS-REFERENCE TO RELATED APPLICATION

This U.S. non-provisional patent application is a divisional of U.S.application Ser. No. 16/293,908, filed on Mar. 6, 2019 in the U.S.Patent and Trademark Office, which claims priority under 35 U.S.C. § 119from, and the benefit of, Korean Patent Application No. 10-2018-0028923,filed on Mar. 13, 2018 in the Korean Intellectual Property Office, thecontents of both of which are herein incorporated by reference in theirentireties.

BACKGROUND

Embodiments of the present disclosure are directed to a method ofmanufacturing a display panel and a display apparatus that includes thedisplay panel, and more particularly, to a method of manufacturing, adisplay panel with improved reliability and a display apparatus thatincludes the display panel.

A display panel is activated by an electrical signal to display animage. Of display panels, an organic light emitting display panel haslow power consumption, high brightness and high response speedcharacteristics.

An organic light emitting display panel includes an organic lightemitting device. However, an organic light emitting device can easily bedamaged by moisture or oxygen. Thus, external moisture or oxygen shouldbe blocked to improve the life span and reliability of an organic lightemitting display panel.

SUMMARY

Embodiments of the present disclosure can provide a display apparatusthat includes a display panel that can prevent interference with anelectronic module, and a method of manufacturing a display panel withsimplified processes.

In an embodiment of the inventive concepts, a method of manufacturing adisplay panel includes providing an insulating substrate that includes ahole area, a display area that surrounds the hole area, and a peripheralarea adjacent to the display area, forming a semiconductor pattern bedisplay area, forming an insulating layer that overlaps the hole areaand the display area on the semiconductor pattern, forming contact holesin the insulating layer that expose portions of the semiconductorpattern, forming electrodes in the contact holes that connect to thesemiconductor pattern through the contact holes, and forming a modulehole by etching a portion of the insulating layer and a portion of theinsulating substrate that overlap the hole area.

In an embodiment, forming the module hole may include forming a firsthole by removing the portion of the insulating layer that overlaps thehole area, forming a second hole by removing a portion of the insulatingsubstrate that overlaps the first hole, and forming an undercut in thesecond hole, wherein the first hole may be simultaneously formed withthe contact holes.

In an embodiment, forming the electrodes may include forming aconductive layer that fills the contact holes and the first hole,forming photoresist patterns on the conductive layer, etching theconductive layer to form the electrodes, and removing the photoresistpatterns. Forming the second hole may be performed simultaneously withetching the conductive layer, and forming the undercut and removing thephotoresist patterns may be performed at the same time

In an embodiment, the photoresist patterns may be removed by oxygenplasma.

In an embodiment, the method may further include forming a blockingrecess in the hole area, wherein the blocking recess is spaced apartfrom the module hole and surrounds at least a portion of the modulehole, wherein a depth of the blocking recess may be less than athickness of the insulating substrate

In an embodiment, the method may further include forming an organiclayer after the forming of the electrodes. An end of the organic layermay be defining boundary of the module hole.

In an embodiment, the organic layer may be formed by at evaporationprocess.

In an embodiment, the method may further include forming an inorganicfilm in the display area after forming the organic layer. The inorganicfilm may extend from the display area into the hole area to cover aninner surface of the module hole.

In an embodiment, the inorganic film may be formed by a depositionprocess.

In an embodiment of the inventive concepts, a display apparatus includesa display panel that includes a front surface that includes a hole area,a display area that surrounds the hole area, and a peripheral areaadjacent to the display area, and a rear surface opposite to the frontsurface, and an electronic module that overlaps the display panel. Thedisplay panel includes an insulating substrate that includes a baselayer and a barrier layer, an organic light emitting device disposed onthe insulating substrate of the display area and that includes anemission layer and an organic layer, an encapsulation member that coversthe organic light emitting device and includes an inorganic film and anorganic film, and a module hole spaced apart from the peripheral areaand formed in the display area that penetrates the insulating substrateand the organic layer. The electronic module overlaps the module hole.The base layer and the barrier layer may include ends at the modulehole, and the end of the base layer and the end of the barrier layer maybe parallel to a thickness direction of the insulating substrate whenviewed in a cross-sectional view.

In an embodiment, the end of the base layer and the end of the barrierlayer may be covered by the inorganic film.

In an embodiment, the end of the base layer and the end of the barrierlayer may not be aligned with each other in the thickness direction.

In an embodiment, an end of the organic layer may be aligned with theend of the barrier layer, and the inorganic film may cover the end ofthe organic layer.

In an embodiment, the electronic module receives an external inputprovided to the front surface of the display panel through the modulehole.

In an embodiment, the electronic module may be received in the modulehole.

In an embodiment, the display panel may further include a blocking,recess formed in the hole area. The blocking recess may be spaced apartfrom the module hole and may surround the module hole, and a depth ofthe blocking recess may be less than a depth of the module hole.

In an embodiment, the blocking recess may include a hole portion thatpenetrates the barrier layer, and a recessed portion formed in the baselayer.

In are embodiment, the base layer includes an organic material and thebarrier layer includes an inorganic material.

In an embodiment of the inventive concepts, a method of manufacturing adisplay panel includes providing an insulating substrate that includes ahole area, a display area surrounding then hole area, and a peripheralarea adjacent to the display area; forming a semiconductor pattern inthe display area; forming an insulating layer that overlaps with thehole area and the display area on the semiconductor pattern; and forminga module hole by etching a portion of the insulating layer and a portionof the insulating substrate that overlap the hole area. Forming themodule hole includes forming a first hole by removing the portion of theinsulating layer that overlaps the hole area; forming a second hole byremoving a portion of the insulating substrate that overlaps with thefirst hole; and forming an undercut in the second hole.

The method may further include forming contact holes in the insulatinglayer that expose portions of the semiconductor pattern; and formingelectrodes in the contact holes that connect to the semiconductorpattern through the contact holes. Forming the electrodes may includeforming a conductive layer that fills the contact holes and the firsthole; forming photoresist patterns on the conductive layer; etching theconductive layer to form the electrodes; and removing the photoresistpatterns. The first hole may be simultaneously formed with the contactholes, the second hole may be formed simultaneously with etching theconductive layer, and forming the undercut and removing the photoresistpatterns may be performed at the same time.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of a display apparatus according to anembodiment of the inventive concepts.

FIG. 2 is an exploded perspective view of a display apparatus of FIG. 1.

FIG. 3 is a block diagram of a display apparatus of FIG. 1 .

FIG. 4A is a cross-sectional view taken along a line I-I′ of FIG. 2 .

FIG. 4B is an enlarged cross-sectional view of a portion of FIG. 4A.

FIG. 5 is an exploded perspective view of a display apparatus accordingto an embodiment of the inventive concepts.

FIG. 6A is a cross-sectional view taken along a line II-II′ of FIG. 5 .

FIG. 6B is an enlarged cross-sectional view of a portion of FIG. 6A.

FIG. 7 is a cross-sectional view of a portion of a display panelaccording to an embodiment of the inventive concepts.

FIGS. 8A to 8C are plan views of hole areas according to someembodiments of the inventive concepts.

FIGS. 9A to 9M are cross-sectional views of a method of manufacturing adisplay panel, according to an embodiment of the inventive concepts.

DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS

Embodiments of the inventive concepts now will be described more fullyhereinafter with reference to the accompanying drawings, in whichvarious embodiments are shown. The inventive concepts may, however, beembodied in many different forms, and should not be construed as limitedto exemplary embodiments set forth herein. Like reference numerals mayrefer to like elements throughout. It will be understood that when anelement such as a layer, region or substrate is referred to as being“on” another element, it can be directly on the other element orintervening elements may be present.

FIG. 1 is a perspective view of a display apparatus according to anembodiment of the inventive concepts. FIG. 2 is an exploded perspectiveview of a display apparatus of FIG. 1 . FIG. 3 is a block diagram of adisplay apparatus of FIG. 1 . Hereinafter, a display apparatus accordingto an embodiment of the inventive concepts will be described withreference to FIGS. 1 to 3 .

A display apparatus ED is activated by an electrical signal. The displayapparatus ED may be realized as various embodiments. For example, thedisplay apparatus ED may be realized as a tablet, a notebook computer, apersonal computer, a smart television, or a smart phone, lit a presentembodiment, a smart phone is illustrated as an example of the displayapparatus ED.

As illustrated in FIG. 1 , according to an embodiment, the displayapparatus ED provides a display surface at its front surface. An imageIM can be displayed on the display surface. The display surface isparallel to a plane defined by a first direction DR1 and a seconddirection DR2. The display surface includes a display area BA and abezel area BZA adjacent to the display area BA.

According to an embodiment, the display apparatus ED displays the imageTM through the display area BA of the display surface. In FIG. 1 , aninternet search box is illustrated as an example of the image IM. Thedisplay area BA has a rectangular shape parallel to the first and seconddirections DR1 and DR2. However, embodiments of the inventive conceptsare not limited thereto. The shape of the display area BA may bevariously modified.

According to an embodiment, the bezel area BZA is adjacent to thedisplay area BA. The bezel area BZA surrounds the display area BA whenviewed in a plan view. However, embodiments of the inventive conceptsare not limited thereto. In other embodiments, the bezel area BZA isadjacent to only one side of the display area BA or is omitted. Thedisplay apparatus ED includes various embodiments but is not be limitedto a specific embodiment.

According to an embodiment, a normal direction of the display surfacecorresponds to a thickness direction, hereinafter referred to as a thirddirection DR3 of the display apparatus ED. In a present embodiment, afront or top surface and a rear or bottom surface of each displayapparatus ED are defined by a direction, such as the third directionDR3, in which the image IM is displayed. The front surface and the rearsurface are opposite to each other in the third direction DR3.

However, directions indicated by the first to third directions DR1, DR2and DR3 may be changed into other directions.

As illustrated in FIGS. 1 to 3 , according to an embodiment, the displayapparatus ED includes a display panel 100, a window member 200, anelectronic module 300, and a housing member 400. In more detail, asillustrated in FIG. 3 , the display apparatus ED includes a displaymodule DD, a first electronic module EM1, a second electronic moduleEM2, and a power supply module PM. Some of components illustrated inFIG. 3 are omitted in FIG. 2 .

According to an embodiment, the display module DD includes the displaypanel 100 and a touch sensing unit TSU. The display panel 100 displaysthe image IM. In an embodiment, the display panel 100 can also sense anexternal user input. In this case, the display panel 100 furtherincludes a touch sensor, and the touch sensing unit TSU can be omitted.

According to an embodiment, the touch sensing unit TSU senses anexternally provided user input. The user's input includes at least oneof various external inputs, such as a part of the user's body, such as afinger, light, heat, or pressure. The touch sensing unit TSU is omittedin FIG. 2 .

On the other hand, in a present embodiment, the display panel 100includes a hole area PA, a display area DA, and a peripheral area NDA.The image IM is displayed through the display area DA. The display areaDA is externally visible through a transmission area TA of the windowmember 200. A plurality of pixels that generate the image IM aredisposed in the display area DA. This will be described below in moredetail.

According to an embodiment, the peripheral area NDA is adjacent to thedisplay area DA. The peripheral area NDA surrounds the display area DAwhen viewed in a plan view. A driving circuit or driving lines thatdrive the display area DA are disposed in the peripheral area NDA.

In an embodiment, a portion of the peripheral area NDA of the displaypanel 100 is curved. Thus, a portion of the peripheral area NDA facesthe front surface of the display apparatus ED, and another portion ofthe peripheral area NDA faces a rear surface of the display apparatusED. Alternatively, the peripheral area NDA may be omitted in the displaypanel 100 according to an embodiment of the inventive concepts.

According to an embodiment, the hole area PA is surrounded by thedisplay area DA when viewed in a plan view. The hole area PA is spacedapart from the peripheral area NDA with the display area DA interposedtherebetween when viewed in a cross-sectional view. A module hole MH isdisposed in the hole area PA. Thus, the module hole MH is formed in thedisplay area DA in which the image IM is displayed.

According to an embodiment, the module hole MH penetrates the displaypanel 100. The module hole MH has a cylindrical shape and has a heightin the third direction DR3. The module hole MN overlaps the electronicmodule 300 when viewed in a plan view. The electronic module 300 isinserted into the module hole MH to receive an external input or canreceive an external input through the module hole MH.

According to an embodiment of the inventive concepts, since the displaypanel 100 includes the module hole MH, no separate space for theelectronic module 300 is provided in the peripheral area NDA. Thus, anarea or a size of the peripheral area NDA can be reduced to realize thedisplay apparatus ED having a narrow bezel. In addition, when theelectronic module 300 is received in the module hole MH, a thin displayapparatus ED can be realized.

According to an embodiment, the window member 200 provides the frontsurface of the display apparatus ED. The window member 200 is disposedon a front surface of the display panel 100 to protect the display panel100. For example, the window member 200 may include a glass substrate, asapphire substrate, or a plastic film. The window member 200 may have asingle-layered or multi-layered structure. For example, the windowmember 200 has a stack structure that includes a plurality of plasticfilms coupled to each other by an adhesive, or has a stack structurewhich includes a glass substrate and a plastic film coupled to eachother by an adhesive.

According to an embodiment, the window member 200 includes thetransmission area TA and the bezel area BZA. The transmission area TAcorresponds to the display area DA of the display panel 100 and thedisplay area BA of the display apparatus ED. For example, thetransmission area TA overlaps all or at least part of the display areaDA. The image IM displayed on the display area DA of the display panel100 is visible through the transmission area TA.

According to an embodiment, the bezel area BZA defines a shape of thetransmission area TA. The bezel area BZA is adjacent to the transmissionarea TA and surrounds the transmission area TA in a plan view. The bezelarea BZA has a predetermined color. The bezel area BZA covers theperipheral area NDA of the display panel 100 to prevent the peripheralarea NDA from being externally visible. However, embodiments of theinventive concepts are not limited thereto. In another embodiment or theinventive concepts, the bezel area BZA may be omitted from the windowmember 200.

According to an embodiment, the power supply module PM supplies powernecessary for the overall operations of the display apparatus ED. Thepower supply module PM includes a battery module.

According to an embodiment, the housing member 400 is coupled to thewindow member 200. The housing member 400 provides the rear surface ofthe display apparatus ED. The housing member 400 may be coupled to thewindow member 200 to surround an inner space, and the display panel 100,the electronic module 300 and various components of FIG. 3 can bereceived in the inner space. The housing member 400 is formed of a rigidmaterial. For example, the housing member 400 includes a plurality offrames or plates, which are formed of glass, plastic, or a metal. Thehousing member 400 can reliably protect the components of the displayapparatus ED in the inner space from external impacts.

According to an embodiment, the electronic module 300 includes at leastone of various functional modules that operate the display apparatus ED.The electronic module 300 includes at least one of components of thefirst electronic module EM1 or the second electronic module EM2.

According to an embodiment, the first electronic module EM1 is mounteddirectly on a motherboard electrically connected to the display moduleDD. Alternatively, the first electronic module EM1 is mounted on anadditional board to be electrically connected to the motherboard througha connector.

According to an embodiment, the first electronic module EM1 includes acontrol module CM, a wireless communication module TM, an image inputmodule IM, a sound input module AIM, a memory MM, and an externalinterface EF. In an embodiment, some of the components or modules arenot mounted on the motherboard but are electrically connected to themotherboard through a flexible circuit board.

According to an embodiment, the control module CM controls the overalloperations of the display apparatus ED. The control module CM includes amicroprocessor. For example, the control module CM can activate ordeactivate the display module DD. The control module CM controls othermodule(s), such as the image input module IM, the sound input moduleAIM, etc., on the basis of a touch signal received from the displaymodule DD.

According to an embodiment, the wireless communication module TMtransmits or receives a wireless signal to or from other terminal(s)using Bluetooth or Wi-Fi. The wireless communication module TM transmitsor receives a voice signal using a general communication line. Thewireless communication module TM includes a transmitter TM1 that canmodulate a signal to be transmitted and transmit the modulated signal,and a receiver TM2 that can demodulate a received signal.

According to an embodiment, the image input module IM processes imagesignals to convert the image signals into image data usable in thedisplay module DD. The sound input module AIM receives an external soundsignal through a microphone m a recording mode or a voice recognitionmode and converts the received sound signals into electrical sound data.

According to an embodiment, the external interface EF is connected toand interfaces with an external charger, a cable or wireless data port,or a card socket, such as a memory card or a SIM/UIM card.

According to an embodiment, the second electronic module EM2 includes asound output module AOM, a light emitting module LM, a light receivingmodule LRM, and a camera module CMM. The components of the secondelectronic module EM2 may be mounted directly on the motherboard or bemounted on an additional board to be electrically connected to thedisplay module DD or the first electronic module EM1 through aconnector.

According to an embodiment, the sound output module AOM converts sounddata received from the wireless communication module TM stored in thememory MM and outputs the converted sound data.

According to an embodiment, the light emitting module LM generates lightand outputs the generated light. The light emitting module LM can outputinfrared light. The light emitting module LM includes a light emittingdiode (LED) device. The light receiving module LRM senses infraredlight. The light receiving module LRM is activated when sensing infraredlight of a predetermined frequency or intensity, or more. The lightreceiving module LRM includes a CMOS sensor. After infrared lightgenerated in the light emitting module LM is output, the infrared lightcan be reflected by an external object, such as a finger or a user'sface, and the reflected infrared light is incident into the lightreceiving module LRM. The camera module CMM can acquire an image.

In an embodiment, the electronic module 300 illustrated in FIG. 2 is oneof the components of the second electronic module EM2. In this case, theother components of the first and second electronic modules EM1 and EM2are disposed at other positions. However, embodiments of the inventiveconcepts are not limited thereto. In other embodiments, the electronicmodule 300 can include one or more other components of the first andsecond electronic modules EM1 and EM2.

FIG. 4A is a cross-sectional view taken along a line I-I′ of FIG. 2 .FIG. 4B is an enlarged cross-sectional view of a portion of FIG. 4A.FIG. 4B is an enlarged view of the module hole MH for the purpose ofease and convenience in description. Hereinafter, an embodiment of theinventive concepts will be described in detail with reference to FIGS.4A and 4B.

As illustrated in FIG. 4A, according to an embodiment, the display panel100 include an insulating substrate 10, a thin film device layer 20, anda display device layer 30. The insulating substrate 10, the thin filmdevice layer 20 and the display device layer 30 are stacked in the thirddirection DR3.

In an embodiment, the insulating substrate 10 includes a first baselayer 11, a first barrier layer 12, a second base layer 13, a secondbarrier layer 14, and a buffer layer 15.

In an embodiment, the first base layer 11 is a lower layer of theinsulating substrate 10. A rear surface of the first base layer 11 is arear surface of the insulating substrate 10.

In an embodiment, the first base layer 11 is an insulating layer thatincludes an organic material. The first base layer 11 includes aflexible plastic. For example, the first base layer 11 may includepolyimide (PI), polyethylene naphthalate (PEN), polyethyleneterephthalate (PET), polyarylate, polycarbonate (PC), polyetherimide(PEI), or polyethersulfone (PES).

In an embodiment, the first barrier layer 12 includes an inorganicmaterial. The first barrier layer 12 is an upper layer of the insulatingsubstrate 10. A front surface of the first barrier layer 12 is a frontsurface of the insulating substrate 10.

In an embodiment, the first barrier layer 12 is an insulating layer thatincludes inorganic material. For example, the first barrier layer 12 mayinclude silicon oxide, silicon nitride, or amorphous silicon.

In an embodiment, the second base layer 13 and the second barrier layer14 are disposed between the first base layer 11 and the first barrierlayer 12. The second base layer 13 includes the same material as thefirst base layer 11. The second barrier layer 14 includes the samematerial as the first barrier layer 12.

In an embodiment, the first and second base layers 11 and 13 and thesecond and first barrier layer 14 and 12 are alternately stacked. Thefirst barrier layer 12 and the second barrier layer 14 are disposed onthe second base layer 13 and the first base layer 11, respectively. Inother words, the second barrier layer 14 is disposed between the firstand second base layers 11 and 13. The first and second barrier layers 12and 14 block external moisture or oxygen from diffusing through thefirst and second base layers 11 and 13.

In an embodiment, the buffer layer 15 is disposed on the first barrierlayer 12. The buffer layer 15 covers a top or front surface of the firstbarrier layer 12. The buffer layer 15 includes an inorganic material.The buffer layer 15 has surface energy higher than that of the topsurface of the first barrier layer 12. An adhesive strength of thebuffer layer 15 to the thin film device layer 20, such as asemiconductor pattern SL car a first insulating layer 21 to be describedbelow, is greater than that of the first barrier layer 12 to the thinfilm device layer 20. Thus, the thin film device layer 20 can be stablyformed on the insulating substrate 10. However, embodiments of theinventive concepts are not limited thereto. In another embodiment, thebuffer layer 15, the second barrier layer 14 and the second base layer13 are omitted from the display panel 100.

In an embodiment, the thin film device layer 20 is disposed on theinsulating substrate 10. The thin film device layer 20 includes aplurality of insulating layers and a thin film transistor TR. Each ofthe insulating layers includes an inorganic material or an organicmaterial. The insulating layers include first to third insulating layers21, 22 and 23.

In an embodiment, the thin film transistor TR includes a semiconductorpattern. SL, a control electrode CE, an input electrode IE, and anoutput electrode OE. The thin film transistor TR controls movement ofcharges in the semiconductor pattern SL by the control electrode CE tooutput an electrical signal, received from the input electrode IE,through the output electrode OE.

In an embodiment, the first insulating layer 21 is disposed between thesemiconductor pattern SL and the control electrode CE. In a presentembodiment, the control electrode CE is disposed on the semiconductorpattern SL. However, embodiments of the inventive concepts are notlimited thereto. In another embodiment, the thin film transistor TRincludes the semiconductor pattern SL disposed on the control electrodeCE.

In an embodiment, the second insulating layer 22 is disposed between thecontrol electrode CE and the input and output electrodes IE and OE. Inother words, the input electrode IE and the output electrode OE aredisposed on the second insulating layer 22. The input electrode IE andthe output electrode OE both penetrate the first and second insulatinglayers 21 and 22 to be connected to portions of the semiconductorpattern SL, respectively. However, embodiments of the inventive conceptsare not limited thereto. In another embodiment, the input electrode IEand the output electrode OE are connected directly to the semiconductorpattern SL.

In an embodiment, the third insulating layer 23 is disposed on thesecond insulating layer 22. The third insulating layer 23 covers thethin film transistor TR. The third insulating layer 23 electricallyinsulates the thin film transistor TR from the display device layer 30.

In an embodiment, the display device layer 30 includes an organic lightemitting device OD and a plurality of insulating layers. The insulatinglayers of the display device layer 30 include a fourth insulating layer31 and an encapsulation member TE.

In an embodiment, the fourth insulating layer 31 is disposed on thethird insulating layer 23. A plurality of openings are formed in thefourth insulating layer 31. The organic light emitting device OD isprovided in each of the openings.

In an embodiment, the organic light emitting device OD includes a firstelectrode E1, a second electrode E2, an emission layer EL, and a chargecontrol layer OL. The first electrode E1 is disposed on the thin filmdevice layer 20. The first electrode E1 penetrates the third insulatinglayer 23 to be electrically connected to the thin film transistor TR. Aplurality of first electrodes E1 are provided. At least a portion ofeach of the first electrodes E1 is exposed by each of the openings.

In an embodiment, the second electrode E2 is disposed on the firstelectrode E1. The second electrode E2 has a single body that overlapsthe plurality of first electrodes E1 and the fourth insulating layer 31.When a plurality of organic light emitting devices OD are provided, thesecond electrode E2 of the organic light emitting devices OD is suppliedwith the same voltage. Thus, an additional patterning process forforming the second electrode E2 can be omitted. However, embodiments ofthe inventive concepts are not limited thereto. In another embodiment, aplurality of second electrode E2 are provided, and the second electrodesE2 respectively correspond to the openings.

In an embodiment, the emission layer EL is disposed between the firstelectrode E1 and the second electrode E2. A plurality of emission layersEL are provided, and the plurality of emission layers EL arerespectively disposed in the plurality of openings. The organic lightemitting device OD activates the emission layer EL by a potentialdifference between the first and second electrodes E1 and E2 to generatelight.

In an embodiment, the charge control layer OL is disposed between thefirst electrode E1 and the second electrode E2. The charge control layerOL is disposed adjacent to the emission layer EL. In a presentembodiment, the charge control layer OL is disposed between the emissionlayer EL and the second electrode E2. However, embodiments of theinventive concepts are not limited thereto. In other embodiments, thecharge control layer OL is disposed between the emission layer EL andthe first electrode E1, or the charge control layer OL includes aplurality of layers stacked in the third direction DR3 with the emissionlayer EL interposed therebetween.

In a embodiment, the charge control layer OL has a single body thatoverlaps an entire top surface of the insulating substrate 10, withoutan additional patterning process. The charge control layer OL may bedisposed in the openings and may also be disposed on a top surface ofthe fourth insulating layer 31.

In a present embodiment, the thin film transistor TR and the organiclight emitting device OD constitute a pixel PX. An electrical signalreceived by the thin film transistor TR is transmitted to the organiclight emitting device OD, and the organic light emitting device OD emitslight that corresponds to the electrical signal. However, embodiments ofthe inventive concepts are not limited thereto. In other embodiments,the pixel PX includes two or more thin film transistors TR or two ormore organic light emitting devices OD, or may further include acapacitor.

In an embodiment, the encapsulation member TE is disposed on the organiclight emitting device OD. The encapsulation member TE includes aninorganic film or an organic film. In a present embodiment, theencapsulation member TE includes a first inorganic film 32, an organicfilm 33, and a second inorganic film 34.

In an embodiment, each of the first and second inorganic films 32 and 34includes an inorganic material. For example, each of the first andsecond inorganic films 32 and 34 includes at least one of aluminumoxide, silicon oxide, silicon nitride, silicon oxynitride, siliconcarbide, titanium oxide, zirconium oxide, or zinc oxide. The firstinorganic film 32 and the second inorganic film 34 may include the samematerial or different materials from each other.

In an embodiment, the organic film 33 is disposed between the firstinorganic film 32 and the second inorganic film 34. The organic film 33includes an organic material. For example, the organic film 33 includesat least one of epoxy, polyimide (PI), polyethylene terephthalate (PET),polycarbonate (PC), polyethylene (PE), or polyacrylate.

In an embodiment, each of the first and second inorganic films 32 and 34has a single body shape disposed on substantially an entire surface ofthe display panel 100. Each of the first and second inorganic films 32and 34 partially overlaps the organic film 33. Thus, the first inorganicfilm 32 and the second inorganic film 34 are spaced apart from eachother in the third direction DR3 with the organic film 33 interposedtherebetween in one area and are in direct contact with each other inanother area.

In addition, in an embodiment, the display panel 100 further includes adam portion DMP. The dam portion DMP extends along an edge of thedisplay area DA. The dam portion DMP surrounds the display area DA or isdisposed at a side of the display area DA, such as a side of the displayarea DA adjacent to a pad or a driving circuit.

In an embodiment, the dam portion DMP includes a first dam DM1 and asecond dam DM2. The first dam DM1 includes the same material as thethird insulating layer 23. The first dam DM1 is simultaneously formedwith the third insulating layer 23 and is disposed on the same layer asthe third insulating layer 23.

In an embodiment, the second dam DM2 is stacked on the first dam DM1.The second dam DM2 includes the same material as the fourth insulatinglayer 31. The second dam DM2 is simultaneously formed with the fourthinsulating layer 31 and is disposed on the same layer as the fourthinsulating layer 31. However, embodiments of the inventive concepts arenot limited thereto. In another embodiment, the dam portion DMP has asingle layered structure.

In an embodiment, the dam portion DMP delimits an area into which aliquid organic material can flow in a process of forming the organicfilm 33. The organic film 33 is formed by an inkjet method in which theliquid organic material is applied onto the first inorganic film 32. Thedam portion DMP forms a boundary of an area into which the liquidorganic material can flow, and prevents the liquid organic material fromoverflowing out of the area bounded by dam portion DMP.

In addition, the display panel 100 according to an embodiment of theinventive concepts further includes an auxiliary electrode pattern ELV.The auxiliary electrode pattern ELV is disposed in the peripheral areaNDA and is electrically connected to the second electrode E2 thatextends from the display area DA. The auxiliary electrode pattern ELVtransmits a stable power voltage received from an external source to thesecond electrode E2.

In a present embodiment, the auxiliary electrode pattern ELV is disposedbetween the second insulating layer 22 and the first inorganic film 32.The auxiliary electrode pattern ELV is disposed on the same layer as theinput electrode IE and the output electrode OE. However, embodiments ofthe inventive concepts are not limited thereto. The auxiliary electrodepattern ELV may be disposed at one of other various positions.

Hereinafter, according to an embodiment, the hole area PA in which themodule hole MH is formed will be described in detail with reference toFIGS. 4A and 4B. The module hole MN penetrates the display panel 100 inthe third direction DR3. The hole area PA is substantially defined byformation of the module hole MH. In other words, since the module holeMH is formed in a portion of the display area DA, the hole area PA is anarea surrounded by the display area DA in a plan view. The module holeMH penetrates the insulating substrate 10 and some of the layers of thedisplay area DA.

In detail, according to an embodiment, the module hole MH penetrates theinsulating substrate 10. An inner surface 10-EG_H of the module hole MHcorresponds to the ends of a plurality of layers. The plurality oflayers include the layers of the insulating substrate 10, one or some ofthe layers of the thin film device layer 20, and one or some of thelayers of the display device layer 30.

According to an embodiment, an end 11-E of the first base layer, an end12-E of the first barrier layer, an end 13-E of the second base layer,an end 14-E of the second barrier layer and an end 15-E of the bufferlayer are defined at the first base layer 11, the first barrier layer12, the second base layer 13, the second barrier layer 14 and the bufferlayer 15 of the insulating substrate 10, respectively.

In a present embodiment, an undercut is formed at the inner surface10-EG_H of the module hole MH. The undercut is formed in the insulatingsubstrate 10. Thus, the end 11-E of the first base layer, the end 12-Eof the first harrier layer, the end 13-E of the second base layer andthe end 14-E of the second barrier layer may not be aligned with eachother in the third direction DR3.

In more detail, according to an embodiment, the end 11-E of the firstbase layer and end 13-E of the second base layer are laterally recessedfrom the ends 12-E and 14-E of the first and second barrier layers andoverlap with the first and second barrier layers 12 and 14, therebyforming the undercut.

According to an embodiment, the undercuts are formed between the firstbase layer 11 and the second harrier layer 14 and between the secondbase layer 13 and the first barrier layer 12. This is due to adifference in etching characteristics between the first and secondbarrier layers 12 and 14, which are formed of an inorganic material, andthe first and second base layers 11 and 13, which are formed of anorganic material. This will be described below in more detail.

In addition, in a present embodiment, the ends 11-E and 13-E of thefirst and second base layers are substantially straight and parallel toeach other in the third direction DR3 when viewed in a cross-sectionalview. Thus, a hole delimited by the end 11-E of the first base layer anda hole delimited by the end 13-E of the second base layer havesubstantially cylindrical shapes, and the undercuts form substantiallyright angles with the first and second barrier layers 12 and 14 thatextend into the module hole MH. This is due to an etching process, whichwill be described below in detail.

According to an embodiment, the module hole MH also penetrates at leastone of the layers of the thin film device layer 20 and at least one oflayers of the display device layer 30. Ends are defined at the layerspenetrated by the module hole MH. In a present embodiment, the modulehole MH penetrates the first insulating layer 21 of the thin film devicelayer 20, and the charge control layer OL and the second electrode E2 ofthe display device layer 30. Thus, an end 21-E of the first insulatinglayer, an end OL-E of the charge control layer and an end E2-E of thesecond electrode are defined at the first insulating layer 21, thecharge control layer OL and the second electrode E2, respectively.

According to an embodiment, the end 21-E of the first insulating layer,the end OL-E of the charge control layer and the end E2-E of the secondelectrode are substantially aligned with each other in the thirddirection DR3. The end 21-E of the first insulating layer, the end OLEof the charge control layer and the end E2-E of the second electrode aresubstantially aligned with the end 15-E of the buffer layer.

According to an embodiment, a hole defined by the end 21-E of the firstinsulating layer, the end OL-E of the charge control layer, the end E2-Eof the second electrode and the end 15-E of the buffer layer have afirst diameter R1. On the other hand, the holes defined by the ends 11-Eand 13-E of the first and second base layers have a second diameter R2.The second diameter R2 is greater than the first diameter R1. Thus, theends 11-E and 13-E of the first and second base layers are undercut fromother layers, and at least one undercut is formed at the inner surface10-EG_H of the module hole MH.

According to an embodiment, the first inorganic film 32 and the secondinorganic film 34 extend into the hole area PA in which the module holeMH is disposed. The first and second inorganic films 32 and 34 extendinto an area adjacent to the module hole MH and extend along the innersurface 10-EG_H of the module hole MH. Thus, the inner surface 10-EG_Hof the module hole MH is covered by the first and second inorganic films32 and 34.

According to an embodiment, the first and second inorganic films 32 and34 cover the end 11-E of the first base layer, the end 12-E of the firstbarrier layer, the end 13-E of the second base layer, the end 14-E ofthe second harder layer, the end 15-E of the buffer layer, the end 21-Eof the first insulating layer, the end OL-E of the charge control layer,and the end E2-E of the second electrode. The first and second inorganicfilms 32 and 34 cover both the undercut ends and the aligned ends.

According to an embodiment, ends cut and exposed by the module hole MHcorrespond to a path by which external oxygen or moisture can permeate.However, according to embodiments of the inventive concepts, the firstand second inorganic films 32 and 34 cover the ends cut and exposed bythe module hole MH, and thus external moisture or oxygen can be blocked.

FIG. 5 is an exploded perspective view of a display apparatus accordingto an embodiment of the inventive concepts. FIG. 6A is a cross-sectionalview taken along a line II-II′ of FIG. 5 . FIG. 6B is an enlargedcross-sectional view of a portion of FIG. 6A. Other components of adisplay apparatus of FIG. 5 may correspond to components of the displayapparatus of FIG. 2 except for the hole area PA. Hereinafter, a presentembodiment will be described with reference to FIGS. 5, 6A and B. In apresent embodiment, the same components as described with reference toFIGS. 1 to 4B may be indicated by the same reference numerals ordesignators, and repetitive descriptions thereto will be omitted for thepurpose of ease and convenience in description.

As illustrated in FIG. 5 , according to an embodiment, a blocking recessBR is further provided in a hole area PA of a display panel 100-1. Theblocking recess BR is adjacent to the module hole MH. The blockingrecess BR is laterally spaced apart from the module hole MH.

According to an embodiment, the blocking recess BR is formed in theinsulating substrate 10 and includes an inner surface that has anundercut shape. The blocking recess BR is recessed down from the frontsurface of the insulating substrate 10 in the third direction DR3. Theblocking recess BR penetrates the front surface of the insulatingsubstrate 10 but does not penetrate the rear surface of the insulatingsubstrate 10.

According to an embodiment, the blocking recess BR includes a firstblocking recess BR1 and a second blocking recess BR2. However, this caseis exemplary and non-limiting. In other embodiments, the blocking recessBR has a single recess. However, embodiments of the inventive conceptsare not limited to the number of the blocking recesses BR.

According to an embodiment, the blocking recess BR is formed by removinga portion of the insulating substrate 10. In detail, the blocking recessBR is formed by removing portions of the first base layer 11, the firstbarrier layer 12, the second base layer 13 and the second barrier layer14. In a present embodiment, the one or some of layers removed to formthe first blocking recess BR1 may differ from the layers removed to formthe second blocking recess BR2.

According to an embodiment, the first blocking recess BR1 is closer tothe module hole MH than the second blocking recess BR2. In other words,the first blocking recess BR1 is disposed between the module hole MH andthe second blocking recess BR2. The first blocking recess BR1 and thesecond blocking recess BR2 form concentric circles around the modulehole MH. The first blocking recess BR1 is formed by removing portions ofthe first base layer 11, the first barrier layer 12, the second baselayer 13, the second barrier layer 14, the buffer layer 15 and the firstinsulating layer 21. The first blocking recess BR1 is a hole thatpenetrates the first barrier layer 12, the second base layer 13 and thesecond barrier layer 14, the buffer layer 15, the first insulating layer21 and a recessed portion in the first base layer 11.

According to an embodiment, the second blocking recess BR2 is closer tothe display area DA than the first blocking recess BR1. The secondblocking recess BR2 is formed by removing portions of the first barrierlayer 12, the second base layer 13, the buffer layer 15 and the firstinsulating layer 21. The second blocking recess BR2 is a hole thatpenetrates the first barrier layer 12, the buffer layer 15, the firstinsulating layer 21 and a recessed portion in the second base layer 13.The second blocking recess BR2 does not reach the second barrier layer14 and the first base layer 11.

According to an embodiment of the inventive concepts, a depth of thefirst blocking recess BR1 differs from a depth of the second blockingrecess BR2. The depth of the second blocking recess BR2 is less than thedepth of the first blocking recess BR1. However, embodiments of theinventive concepts are not limited thereto. In other embodiments, thefirst and second blocking recesses BR1 and BR2 have the same shape andthe same depth, or the depth of the second blocking recess BR2 isgreater than the depth of the first blocking recess BR1. The shape ofthe blocking recess BR according to embodiments of the inventiveconcepts may be variously modified.

According to an embodiment, the charge control, layer OL extends into anarea adjacent to the module hole MH and an area adjacent to the blockingrecess BR. The charge control layer OL does not overlap the blockingrecess BR. Thus, the charge control layer OL has a cut end adjacent tothe blocking recess BR.

According to an embodiment, the second electrode E2 extends into an areaadjacent to the module hole MH and an area adjacent to the blockingrecess BR. The second electrode E2 does not overlap the blocking recessBR. Thus, the second electrode E2 has a cut end adjacent to the blockingrecess BR.

According to an embodiment, the first inorganic film 32 and the secondinorganic film 34 extend into the area in which the blocking recess BRis formed. The first and second inorganic films 32 and 34 are disposedin the area adjacent to the blocking recess BR and extend along innersurfaces 10-EG_B1 and 10-EG_B2 of the blocking recess BR. Thus, theinner surfaces 10-EG_B1 and 10-EG_B2 of the blocking recess BR arecovered by the first and second inorganic films 32 and 34.

According to an embodiment of the inventive concepts, the charge controllayer OL has a cut end adjacent to the blocking recess BR and does notoverlap the blocking recess BR. The cut end of the charge control layerOL adjacent to the blocking recess BR is covered by the first inorganicfilm 32 and the second inorganic film 34.

According to an embodiment of the inventive concepts, the secondelectrode E2 has a cut end adjacent to the blocking recess BR and doesnot overlap the blocking recess BR. The cut end of the second electrodeE2 adjacent to the blocking recess BR is covered by the first inorganicfilm 32 and the second inorganic film 34.

According to the embodiment of the inventive concepts, since theblocking recess BR is adjacent to the module hole MH, moisture or oxygencan be blocked from permeating from the module hole MH. The chargecontrol layer OL and the second electrode E2 of which ends are exposedby the module hole MH are separated from the charge control layer OL andthe second electrode E2 of the display area DA by the blocking recessBR. The blocking recess BR separates portions of the charge controllayer OL and the second electrode E2 disposed between the module hole MHand the blocking recess BR from other portions of the charge controllayer OL and the second electrode E2 disposed outside the blockingrecess BR. Thus, even though external moisture or oxygen is are presentin the module hole MH, the external moisture or oxygen do not diffusepast the blocking recess BR. As a result, it is possible to preventdamage to the thin film device layer 20 or the display device layer 30disposed outside the blocking recess BR.

In addition, according to an embodiment of the inventive concepts, thefirst inorganic film 32 and the second inorganic film 34 cover portionsbetween the module hole MH and the blocking recess BR, the inside of theblocking recess BR, and the portion outside the blocking recess BR. Inother words, the charge control layer OL, the second electrode E2, thefirst insulating layer 21, and the buffer layer 15, which are adjacentto the blocking recess BR and cut, are covered by the first inorganicfilm 32 and the second inorganic film 34. Thus, external moisture oroxygen can be further blocked.

FIG. 7 is a cross-sectional view of a portion of a display panelaccording to an embodiment of the inventive concepts. FIG. 7 illustratesan area of FIG. 4A for the purpose of ease and convenience indescription. Hereinafter, a display panel 100-2 according to anembodiment of the inventive concepts will be described with reference toFIG. 7 . In a present embodiment, the same components as described withreference to FIGS. 1 to 6B may be indicated by the same referencenumerals or designators, and repetitive descriptions there will beomitted for the purpose of ease and convenience in description.

As illustrated in FIG. 7 , according to an embodiment, a module holeMH-1 penetrates the second insulating layer 22. An inner surface10-EG_H1 of the module hole MH-1 includes the ends 11-E, 12-E, 13-E,14-E and 15-E of the insulating substrate 10, the end 21-E of the firstinsulating layer, an end 22-E of the second insulating layer, the endOL-E of the charge control layer, and the end E2-E of the secondelectrode. In other words, the second insulating layer 22 extends intothe hole area PA and is cut by the module hole MH-1, unlike the displaypanel 100 illustrated in FIG. 4A.

According to an embodiment, the first and second inorganic films 32 and34 cover the exposed end 22-E of the second insulating layer. A depth ofthe module hole MH-1 is increased by a thickness of the secondinsulating layer 22, as compared with the module hole MH illustrated inFIG. 4A.

According to embodiments of the inventive concepts, the module hole MH-1penetrates various layers. The module hole MH-1 penetrates theinsulating substrate 10 to include the undercut inner surfaces andpenetrates various layers disposed under the charge control layer OL.According to an embodiment of the inventive concepts, since the modulehole MH-1 penetrates the second insulating layer 22 disposed under thecharge control layer OL, the charge control layer OL on the secondinsulating layer 22 and the second electrode E2 on the charge controllayer OL are cut by the module hole MH-1. Thus, the first and secondinorganic films 32 and 34 cover the cut ends OL-E and E2-E of the chargecontrol layer OL and the second electrode E2, respectively, to preventthe charge control layer OL and the second electrode E2 from externalcontact.

FIGS. 8A to 8C are plan views of hole areas according to someembodiments of the inventive concepts. In FIGS. 8A to 8C, somecomponents that corresponding to hole areas PA1, PA2 and PA3 are hatchedfor the purpose of ease and convenience in description. Hereinafter,some embodiments of the inventive concepts will be described withreference to FIGS. 8A to 8C.

As illustrated in FIG. 8A, according to an embodiment, a hole area PA1includes a module hole MH-S1 and one or more blocking recesses BR1-S1and BR2-S1. The module hole MH-S1 has a polygonal shape when viewed in aplan view. In a present embodiment, the module hole MH-S1 has aquadrilateral shape. In this case, the module hole MH-S1 has a hollowpolygonal pillar shape.

According to an embodiment, the blocking recesses BR1-S1 and BR2-S1 areformed along an edge of the module hole MH-S1. The blocking recessesBR1-S1 and BR2-S1 have shapes that correspond to the shape of the modulehole MH-S1. Thus, the blocking recesses BR1-S1 and BR2-S1 haveconcentric quadrilateral ring shapes that surround the module hole MH-S1when viewed in a plan view.

Alternatively, according to an embodiment, as illustrated in FIG. 8B, ahole area PA2 includes a module hole MH-S2 and one or more blockingrecesses BR1-S2 and BR2-S2 that have different shapes from that of themodule hole MH-S2. The module hole MH-S2 has a circular shape whenviewed in a plan view. The blocking recesses BR1-S2 and BR2-S2 haveshapes that differ from the shape of the module hole MH-S2. In a presentembodiment, the blocking recesses BR1-S2 and BR2-S2 have quadrilateralring shapes. According to some embodiments of the inventive concepts,the blocking recesses BR1-S2 and BR2-S2 have one of various shapesconcentric about the module hole MH-S2. In other words, according toembodiments of the inventive concepts, the shapes of the blockingrecesses are not limited to correspond to the shape of the module hole.

As illustrated in FIG. 8C, according to an embodiment, a hole area PA3includes a module hole MH-S3 and one or more blocking recesses BR1-S3and BR2-S3 that have different shapes from that of the module holeMH-S3. In a present embodiment, the blocking recesses BR1-S3 and BR2-S3have concentric octagonal ring shapes. As the shapes of the blockingrecesses BR1-S3 and BR2-S3 become more similar to the shape of themodule hole MH-S3, an area of a spaces between the module hole MH-S3 andthe blocking recesses BR1-S3 and BR2-S3 is reduced. Thus, an areaoccupied by the bole area PA3 in the display area DA can be reduced toreduce an influence of the hole area PA3 on the display area DA.

FIGS. 9A to 9M are cross-sectional views that illustrate a method ofmanufacturing a display panel, according to an embodiment of theinventive concepts. FIGS. 9A to 9M illustrate a method of manufacturinga display panel 100-2 illustrated in FIG. 7 . Hereinafter, amanufacturing method according to an embodiment of the inventiveconcepts will be described with reference to FIGS. 9A to 9M.

Referring to FIG. 9A, according to an embodiment, an insulatingsubstrate 10 is formed on a carrier substrate CS, and a semiconductorpattern SL is formed on the insulating substrate 10. A plurality ofsemiconductor patterns SL are formed. In detail, a semiconductormaterial is formed on the buffer layer 15 of the insulating substrate10, and then, a patterning process is performed on the semiconductormaterial to form the semiconductor patterns SL.

Referring to FIG. 9B, according to an embodiment, a first insulatinglayer 21 and a control electrode CE are sequentially formed on theinsulating substrate 10. The first insulating layer 21 is formed bycovering the semiconductor pattern SL with an insulating material. Thefirst insulating layer 21 is formed by depositing an inorganic material.The first insulating layer 21 is thrilled on an entire top surface ofthe insulating substrate 10.

According to an embodiment, a conductive material is formed on the firstinsulating layer 21, and then, a patterning process is performed on theconductive material to form the control electrode CE. A plurality ofcontrol electrodes CE are formed, and the control electrodes CE overlapthe semiconductor patterns SL, respectively.

Referring to FIG. 9C, according to an embodiment, a second insulatinglayer 22 is formed on the insulating substrate 10. The second insulatinglayer 22 is formed by depositing an insulating material on the entiretop surface of the insulating substrate 10. The second insulating layer22 covers the control electrode CE and is formed on an entire topsurface of the first insulating layer 21. The second insulating layer 22is formed of an inorganic material and may have a single-layeredstructure or a multi-layered structure that includes a plurality ofstacked layers.

Referring to FIG. 9D, according to an embodiment, a first etching gasET1 is provided to form a plurality of contact holes CH and a firstopening OP1 in the first and second insulating layers 21 and 22. In thepresent embodiment, the first opening OP1 and the contact holes CH areformed at the same time by the first etching gas ET1.

According to an embodiment, the contact holes CH are formed in thedisplay area DA. The contact holes CH overlap the semiconductor patternSL to expose portions of the semiconductor pattern SL. The first openingOP1 are formed in the hole area PA. The first opening OP1 penetrates thefirst and second insulating layers 21 and 22 to expose the buffer layer15. In addition, a portion of the buffer layer 15 is removed by thefirst etching gas ET1 due to the materials of the first etching gas ET1and the buffer layer 15, and thus the buffer layer 15 is relatively thinin the hole area PA.

Referring to FIG. 9E, according to an embodiment, a conductive layer CLLa a photoresist pattern PR are sequentially formed on the insulatingsubstrate 10. The conductive layer CLL is formed by depositing aconductive material on the second insulating layer 22. Thus, theconductive layer CLL covers a top surface of the second insulating layer22, inner surfaces of the contact holes CH, and an inner surface of thefirst opening OP1.

According to an embodiment, the photoresist pattern PR is formed on theconductive layer CLL. A top surface of the conductive layer CLL iscoated with a photoresist material, and then, the photoresist materialis patterned through a photolithography process to form the photoresistpattern PR. The photoresist pattern PR is formed in the display area DAand is formed to correspond to each of the contact holes CH.

In addition, in a present embodiment, the photoresist pattern PR is alsoformed in the peripheral area NDA. The photoresist pattern PR in theperipheral area NDA functions as a mask for patterning an auxiliaryelectrode pattern ELV to be described below.

Referring to FIG. 9F, according to an embodiment, after forming thephotoresist patterns PR, a second etching gas ET2 is provided to form aninput electrode IE and an output electrode OE from the conductive layerCLL. The second etching gas ET2 reacts with portions of the conductivelayer CLL exposed by the photoresist patterns PR to remove the exposedportions of the conductive layer CLL from the insulating substrate 10.Thus, portions of the conductive layer CLL which fill the contact holesCH under the photoresist patterns PR remains and the second insulatinglayer 22 is exposed by the removal of the exposed portions of theconductive layer CLL. At this time, the remaining portions of theconductive layer CLL that fill the contact holes CH correspond to theinput electrode IE and the output electrode OE. A portion of theconductive layer CLL that covers the inner surface of the first openingOP1 is also removed by the second etching gas ET2 to expose the innersurface of the first opening OP1. In addition, an auxiliary electrodepattern ELV is formed under the photoresist pattern PR in the peripheralarea NDA.

Referring to FIG. 9G, according to an embodiment, an additional etchinggas ET2-1 is provided to form a second opening OP2 in the hole area PA.The second opening OP2 is formed by removing a portion of the insulatingsubstrate 10, which overlaps the first opening OP1. In detail, thesecond opening OP2 is formed by removing portions of the first baselayer 11, the first barrier layer 12, the second base layer 13, thesecond barrier layer 14 and the buffer layer 15, which overlap the holearea PA. A portion of the carrier substrate CS is exposed by the secondopening OP2.

According to an embodiment, the first opening OP1 and the second openingOP2 are connected to each other in the third direction DR3 to form afirst hole H1. The first hole H1 penetrates the insulating substrate 10and a plurality of the insulating layers 21 and 22. The first hole H1 isbounded by an end 11-E1 of the first base layer, an end 12-E1 of thefirst barrier layer, an end 13-E1 of the second base layer, an end 14-E1of the second barrier layer, an end 15-E1 of the buffer layer, an end21-E1 of the first insulating layer, and an end 22-E1 of the secondinsulating layer. The etching process that uses the additional etchinggas ET2-1 is an anisotropic etching process. Thus, the end 11-E1 of thefirst base layer, the end 12-E1 of the first harrier layer, the end13-E1 of the second base layer, the end 14-E1 of the second barrierlayer, the end 15-E1 of the buffer layer, the end 21-E1 of the firstinsulating layer, and the end 22-E1 of the second insulating layer arealigned with each other in the third direction DR3.

In a present embodiment, the first and second insulating layers 21 and22 that have the first opening OP1 function as a mask or forming thesecond opening OP2. Thus, the additional etching gas ET2-1 includes amaterial that has a low reactivity with the first or second insulatinglayer 21 or 22 and a high reactivity with the insulating substrate 10.

According to an embodiment, the additional etching gas ET2-1 includesthe same material as the second etching gas ET2. When the second etchinggas ET2 has a high reactivity with the insulating substrate 10 and a lowreactivity with the second or first insulating layers 22 or 21, thefirst hole H1 is firmed by providing the second etching gas ET2 for alonger period of time. Thus, the first hole H1 is easily formed withoutan additional process.

Alternatively, according to an embodiment, the additional etching gasET2-1 includes a different material from that of the second etching gasET2. In this case, the additional etching gas ET2-1 includes a materialfor which a reactivity with the insulating substrate 10 is higher than areactivity of the second etching gas ET2 with the insulating substrate10. Thus, even though the second etching gas ET2 has a low reactivitywith the Insulating substrate 10, the first hole H1 is easily formed bychanging the second etching gas ET2 into the additional etching gasET2-1.

Referring to FIG. 9H, according to an embodiment, an ashing gas AS isprovided to remove the photoresist patterns PR. The ashing gas ASincludes oxygen plasma. The ashing gas AS reacts with the photoresistpatterns PR to reduce the bonding strength between the photoresistpatterns PR and the conductive patterns ELV, IE and OE and removes thephotoresist patterns PR.

However, according to an embodiment, the ashing gas AS also reacts withthe first and second base layers 11 and 13 exposed by the first hole H1.The first and second base layers 11 and 13 are partially removed by theasking gas AS. The first and second base layers 11 and 13 include anorganic material, which is similar to that of the photoresist patternsPR. Thus, the first and second base layers 11 and 13 have a highreactivity with the ashing gas AS.

On the other hand, according to an embodiment, the ashing gas AS doesnot react with the first and second barrier layers 12 and 14, which areformed of an inorganic material. Thus, the first base layer 11 has ashape undercut from the second barrier layer 14, and the second baselayer 13 has a shape undercut from the first barrier layer 12.

According to an embodiment, after providing the ashing gas AS, an end11-E of the first base layer and an end 13-E of the second base layerare no longer aligned with an end 12-E of the first barrier layer and anend 14-E of the second barrier layer. Thus, a second hole H2 is formedwhose inner surfaces have one or more undercut shapes. The second holeH2 is bounded by the end 11-E of the first base layer, the end 12-E ofthe first barrier layer, the end 13-E of the second base layer, the end14-E of the second barrier layer, an end 15-E of the buffer layer, anend 21-E of the first insulating layer, and an end 22-E of the secondinsulating layer.

Referring to FIG. 9I, according to an embodiment, a third insulatinglayer 23, a first electrode E1, a fourth insulating layer 31 and anemission layer EL are sequentially formed on the insulating substrate10. The third insulating layer 23 is formed on the second insulatinglayer 22 to cover the thin film transistor TR that includes theelectrodes CE, IE and OE and the semiconductor pattern SL. The thirdinsulating layer 23 is patterned to be spaced apart from the auxiliaryelectrode pattern ELV and the hole area PA. However, embodiments of theinventive concepts are not limited thereto. In another embodiment, thethird insulating layer 23 extends into the hole area PA and includes anend that bounds the second hole H2.

According to an embodiment, the first electrode E1 is formed on thethird insulating layer 23. In detail, a conductive material is formed,and then the conductive material is patterned to form the firstelectrode E1. The first electrode E1 penetrates the third insulatinglayer 23 to be connected to the output electrode OE. A plurality offirst electrodes E1 are provided, and the first electrodes E1 correspondto the thin film transistors TR.

According to an embodiment, fourth insulating layer 31 is formed on thethird insulating layer 23 and covers the first electrode E1. In detail,an insulating material is deposited and then patterned to form thefourth insulating layer 31. A plurality of openings are formed in thefourth insulating layer 31. The openings expose the first electrodes E1.

According to an embodiment, the emission layer EL is formed in each ofthe openings of the fourth insulating layer 31. The emission layer EL isformed using a process, such as an inkjet process, of a depositionprocess.

In addition, according to an embodiment, a dam portion DMP issimultaneously formed with the third and fourth insulating layers 23 and31. For example, a first dam portion DMP1 of the dam portion DMP isformed when the third insulating layer 23 is formed, and a second damportion DMP2 of the dam portion DMP is formed when the openings areformed in the fourth insulating layer 31. Thus, the dam portion DMP canbe formed without an additional process.

Referring to FIG. 9J, according to an embodiment, charge control layerOL is formed on the fourth insulating layer 31. The charge control layerOL over the whole display area DA and in at least a portion of theperipheral area NDA.

According to an embodiment, the charge control layer OL is formed bydepositing an organic material through an open mask. The charge controllayer OL is formed by an evaporation process in which the organicmaterial is provided in the third direction DR3. Thus, the chargecontrol layer OL is not formed on the inner surface of the second holeH2 but rather on a top surface of the second insulating layer 22, a topsurface of the third insulating layer 23, and a top surface of thefourth insulating layer 31.

Referring to FIG. 9K, according to an embodiment, a second electrode E2is formed on the charge control layer OL. Forming the second electrodeE2 completes the formation of an organic light emitting device OD and apixel PX.

According to an embodiment, the second electrode E2 is formed over thewhole display area DA through an open mask. In addition, the secondelectrode E2 is also formed in at least a portion of the peripheral areaNDA. In a present embodiment, the second electrode E2 extends into theperipheral area NDA to be connected to the auxiliary electrode patternELV. The second electrode E2 is also deposited in the third directionDR3 and thus does not form on the inner surface of the second hole H2.

Referring to FIG. 9L, according to an embodiment, an encapsulationmember TE is formed on the second electrode E2. The encapsulation memberTE substantially covers an area on which the second electrode E2 isformed, and thus the encapsulation member TE can encapsulate the organiclight emitting device OD.

According to an embodiment, a first inorganic film 32 of theencapsulation member TE is formed on an entire surface of the insulatingsubstrate 10 by a chemical vapor deposition (CVD) process. At this time,the first inorganic film 32 is isotropically deposited to cover theinner surface of the second hole H2. The first inorganic film 32 isformed on the ends and the undercut portions, which bound the secondhole H2.

According to an embodiment, an organic film 33 of the encapsulationmember TE is formed by an inkjet process. A viscous liquid organicmaterial is provided to an area of the display area DA spaced apart fromthe hole area PA and flows onto and coats at least a portion of thefirst inorganic film 32.

According to an embodiment, a second inorganic film 34 of theencapsulation member TE is formed by a deposition process. Thus, thesecond inorganic film 34 is formed on the entire portion of the organicfilm 33 and the first inorganic film 32. The second inorganic film 34 isformed similarly to the first inorganic film 32. Thus, the secondinorganic film 34 covers inner surfaces of the undercut portions in thehole area PA. The second hole H2 covered by the first and secondinorganic films 32 and 34 is a module hole MH.

Referring to FIG. 9M, according to an embodiment, the carrier substrateCS is removed to manufacture a display panel. Thus, the first and secondinorganic films 32 and 34 that remain on the carrier substrate CSexposed in the hole area PA are removed to form the module hole MH inthe hole area PA.

According to embodiments of the inventive concepts, the module hole MHis formed through a plurality of etching processes and an ashingprocess. Thus, the module hole MH can be formed without an additionalprocess. As a result, a manufacturing process is simplified and aprocess cost is reduced. In addition, since the module hole MH is formedusing a difference of etching rates, fine features of the module hole MHcan be easily formed.

In addition, according to an embodiment, the blocking recess BR of FIG.5B can be formed by a method similar to the method of forming the modulehole MH. However, the inventive concepts are not limited to a specificembodiment.

According to embodiments of the inventive concepts, a display panel isprovided that does not interfere with an electronic module. Thus, eventhough the display apparatus includes an electronic module, a displayapparatus can be provided which has a wide display area without anincreased bezel area. In addition, components can be protected fromdamage from external moisture or oxygen. Thus, the reliability of amanufacturing process and the display apparatus itself can be improved.

Furthermore, according to embodiments of the inventive concepts, amodule hole with reduced defects can be easily formed without anadditional process. Thus, the manufacturing processes can be simplifiedand the process cost can be reduced.

While embodiments of the inventive concepts have been described withreference to exemplary embodiments, it will be apparent to those skilledin the art that various changes and modifications may be made withoutdeparting from the spirits and scopes of exemplary embodiment of theinventive concepts. Therefore it should be understood that exemplaryembodiments are not limiting, but illustrative. Thus, the scopes ofembodiments of the inventive concepts are to be determined by thebroadest permissible interpretation of the following claims and theirequivalents, and shall not be restricted or limited by the foregoingdescription.

What is claimed is:
 1. A display apparatus, comprising: a display panelthat includes a front surface that includes a hole area, a display areathat surrounds the hole area, and a peripheral area adjacent to thedisplay area; and a rear surface opposite to the front surface; and anelectronic module that overlaps the display panel, wherein the displaypanel comprises: an insulating substrate that includes a base layer anda barrier layer; an organic light emitting device disposed on theinsulating substrate of the display area and that includes an emissionlayer and an organic layer; an encapsulation member that covers theorganic light emitting device and includes an inorganic film and anorganic film; and a module hole spaced apart from the peripheral areaand formed in the hole area that penetrates the insulating substrate andthe organic layer, wherein the electronic module overlaps the modulehole, wherein the base layer and the barrier layer include ends at themodule hole; and wherein the end of the base layer and the end of thebarrier layer are covered by the inorganic film.
 2. The displayapparatus of claim 1, wherein the end of the base layer and the end ofthe barrier layer are not aligned with each other in the thicknessdirection.
 3. The display apparatus of claim 2, wherein an end of theorganic layer is aligned with the end of the barrier layer, and whereinthe inorganic film covers the end of the organic layer.
 4. The displayapparatus of claim 1, wherein the electronic module receives an externalinput provided to the front surface of the display panel through themodule hole.
 5. The display apparatus of claim 2, wherein the electronicmodule is received in the module hole.
 6. The display apparatus of claim1, wherein the display panel further comprises: a blocking recess formedin the hole area, wherein the blocking recess is spaced apart from themodule hole and surrounds the module hole, wherein a depth of theblocking recess is less than a depth of the module hole.
 7. The displayapparatus of claim 6, wherein the blocking recess includes: a holeportion that penetrates the barrier layer; and a recessed portion formedin the base layer.
 8. The display apparatus of claim 1, wherein the baselayer includes an organic material and the harrier layer includes aninorganic material.